NXP Semiconductors MC9S12G - Page 1272

Package and Die Information
MC9S12G Family Reference Manual Rev.1.27
1274 NXP Semiconductors
28 28 -1315.5 -1472.06 PB[3]
29 29 -1134.5 -1472.06 PP[0]
30 30 -964.5 -1472.06 PP[1]
31 31 -794.5 -1472.06 PP[2]
32 32 -660.5 -1472.06 PP[3]
33 33 -526.5 -1472.06 PP[4]
34 34 -404.5 -1472.06 PP[5]
35 35 -292.5 -1472.06 PP[6]
36 36 -190.5 -1472.06 PP[7]
37 37 -105.5 -1472.06 VDDX3
38 38 -0.5 -1472.06 VSSX3
39 39 93.5 -1472.06 PT[7]
40 40 189.5 -1472.06 PT[6]
41 41 291.5 -1472.06 PT[5]
42 42 403.5 -1472.06 PT[4]
43 43 525.5 -1472.06 PT[3]
44 44 659.5 -1472.06 PT[2]
45 45 805.5 -1472.06 PT[1]
46 46 964.5 -1472.06 PT[0]
47 47 1120.5 -1472.06 PB[4]
48 48 1242.5 -1472.06 PB[5]
49 49 1412.5 -1472.06 PB[6]
50 50 1582.5 -1472.06 PB[7]
51 51 -1832.06 -1347.5 PC[0]
52 52 -1832.06 -1139.5 PC[1]
53 53 -1832.06 -1022.5 PC[2]
54 54 -1832.06 -905.5 PC[3]
55 55 -1832.06 -788.5 PAD[0]
56 56 -1832.06 -681.5 PAD[8]
57 57 -1832.06 -574.5 PAD[1]
Table D-1. Bondpad Coordinates
Die Pad Bond Post
Die Pad
X Coordinate
Die Pad
Y Coordinate
Function