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NXP Semiconductors MC9S12G User Manual
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Scalable Controller Area Network (S12MSCANV3
)
MC9S12G Family Refere
nce Manual Rev
.1.27
622
NXP Semiconductors
619
621
Table of Contents
Device Overview Mc9S12G-Family
7
Table of Contents
7
Table of Contents
22
Chapter 1 Device Overview MC9S12G-Family
27
Features
28
Chip-Level Features
30
S12 16-Bit Central Processor Unit (CPU)
31
Main External Oscillator (XOSCLCP)
32
System Integrity Support
33
Serial Communication Interface Module (SCI)
34
Reference Voltage Attenuator (RVA)
35
Key Performance Parameters
36
Family Memory Map
37
Part ID Assignments
42
Ps3
37
Signal Description and Device Pinouts
43
Detailed Signal Descriptions
44
Power Supply Pins
48
Device Pinouts
51
Pm0
54
S12GNA16 and S12GNA32
58
S12Gn48
60
Ps4
54
Ps5
54
Ps6
54
Ps7
54
Pm2
69
Pm3
69
The Regular I/O Characteristics
69
S12G48 and S12G64
70
Miso0
78
Mosi0
79
S12GA48 and S12GA64
80
S12G96 and S12G128
87
Api_Extc
95
S12GA96 and S12GA128
99
S12G192 and S12G240
111
S12GA192 and S12GA240
123
1.9 System Clock Description
138
Default Chapter
138
System Clock Description
138
Chip Configuration Summary
139
Interrupt Vectors
140
Effects of Reset
142
Autonomous Clock (ACLK) Configuration
143
ADC Result Reference
144
BDM Clock Source Connectivity
145
Chapter 2 Port Integration Module (S12GPIMV1)
147
Overview
148
Block Diagram
149
Package Code
150
PIM Routing - Functional Description
152
Pin BKGD
161
Pins PD7-0
163
Pins PS7-0
165
Pins PM3-0
167
Pins PJ7-0
169
Pins AD15-0
170
PIM Ports - Memory Map and Register Definition
176
Register Map
179
Register Descriptions
194
PIM Ports - Functional Description
239
Pin Configuration Summary
241
Interrupts
242
Initialization/Application Information
244
Emulation of Smaller Packages
245
Chapter 3 5V Analog Comparator (ACMPV1)
247
External Signals
248
Memory Map and Register Definition
249
Functional Description
251
Chapter 4 Reference Voltage Attenuator (RVAV1)
253
External Signals
254
Memory Map and Register Definition
255
Functional Description
256
Chapter 5 S12G Memory Map Controller (S12GMMCV1)
257
Features
258
External Signal Description
259
Register Descriptions
260
Functional Description
264
Unimplemented and Reserved Address Ranges
268
Prioritization of Memory Accesses
269
Chapter 6 Interrupt Module (S12SINTV1)
271
Modes of Operation
272
External Signal Description
273
Functional Description
274
Reset Exception Requests
275
Initialization/Application Information
276
Chapter 7 Background Debug Module (S12SBDMV1)
279
Modes of Operation
280
Block Diagram
281
Register Descriptions
282
Family ID Assignment
285
Security
286
BDM Hardware Commands
287
Standard BDM Firmware Commands
288
BDM Command Structure
289
BDM Serial Interface
291
Serial Interface Hardware Handshake Protocol
294
Hardware Handshake Abort Procedure
296
SYNC — Request Timed Reference Pulse
299
Serial Communication Time out
300
Chapter 8 S12S Debug Module (S12SDBGV2)
303
Overview
304
Modes of Operation
305
External Signal Description
306
Register Descriptions
307
Functional Description
322
S12SDBG Operation
323
Match Modes (Forced or Tagged)
327
State Sequence Control
328
Trace Buffer Operation
329
Tagging
336
Application Information
338
Scenario 2
339
Scenario 5
341
Scenario 8
342
Chapter 9 Security (S12XS9SECV2)
345
Securing the Microcontroller
346
Operation of the Secured Microcontroller
347
MC9S12G Family Reference Manual Rev.1.27 NXP Semiconductors
348
Complete Memory Erase (Special Modes)
349
Chapter 10 S12 Clock, Reset and Power Management Unit (S12CPMU)
351
Features
352
Modes of Operation
353
S12CPMU Block Diagram
356
Signal Description
357
VDDR — Regulator Power Input Pin
358
VDD — Internal Regulator Output Supply (Core Logic)
359
Register Descriptions
361
Functional Description
387
Startup from Reset
388
Stop Mode Using PLLCLK as Bus Clock
389
External Oscillator
390
System Clock Configurations
391
Resets
393
Power-On Reset (POR)
395
Interrupts
396
Initialization/Application Information
398
Chapter 11 Analog-To-Digital Converter (ADC10B8CV2)
403
Features
404
Modes of Operation
405
Block Diagram
406
Signal Description
407
Register Descriptions
409
Functional Description
424
Resets
426
Chapter 12 Analog-To-Digital Converter (ADC12B8CV2)
427
Features
428
Modes of Operation
429
Block Diagram
430
Signal Description
431
Register Descriptions
433
Functional Description
449
Resets
451
Chapter 13 Analog-To-Digital Converter (ADC10B12CV2)
453
Introduction
454
Modes of Operation
455
Block Diagram
456
Signal Description
457
Register Descriptions
460
Functional Description
475
Resets
477
Chapter 14 Analog-To-Digital Converter (ADC12B12CV2)
479
Introduction
480
Modes of Operation
481
Block Diagram
482
Signal Description
483
Register Descriptions
486
Functional Description
502
Resets
504
Chapter 15 Analog-To-Digital Converter (ADC10B16CV2)
505
Introduction
506
Modes of Operation
507
Block Diagram
508
Signal Description
509
Register Descriptions
512
Functional Description
527
Resets
529
Chapter 16 Analog-To-Digital Converter (ADC12B16CV2)
531
Introduction
532
Modes of Operation
533
Block Diagram
534
Signal Description
535
Register Descriptions
538
Functional Description
554
Resets
556
Chapter 17 Digital Analog Converter (DAC_8B5V)
557
Features
558
Block Diagram
559
AMPM Input Pin
560
Register Descriptions
561
Functional Description
562
Mode "Off
563
Mode "Unbuffered DAC
564
Chapter 18 Scalable Controller Area Network (S12MSCANV3)
567
Glossary
568
Features
569
TXCAN — CAN Transmitter Output Pin
570
Register Descriptions
572
Programmer's Model of Message Storage
591
Functional Description
601
Message Storage
602
Identifier Acceptance Filter
605
Modes of Operation
611
Low-Power Options
613
Reset Initialization
617
Initialization/Application Information
619
Chapter 19 Pulse-Width Modulator (S12PWM8B8CV2)
621
Block Diagram
622
Memory Map and Register Definition
623
Functional Description
638
PWM Channel Timers
641
Resets
648
Interrupts
649
Chapter 20 Serial Communication Interface (S12SCIV5)
651
Features
652
Block Diagram
653
Module Memory Map and Register Definition
654
Functional Description
665
Infrared Interface Submodule
666
LIN Support
667
Baud Rate Generation
669
Transmitter
670
Receiver
675
Single-Wire Operation
683
Loop Operation
684
Interrupt Operation
685
Recovery from Wait Mode
687
Chapter 21 Serial Peripheral Interface (S12SPIV5)
689
Modes of Operation
690
External Signal Description
691
MISO — Master In/Slave out Pin
692
Register Descriptions
693
Functional Description
701
Master Mode
702
Slave Mode
703
Transmission Formats
704
MC9S12G Family Reference Manual Rev.1.27 NXP Semiconductors
708
SPI Baud Rate Generation
710
Special Features
711
Error Conditions
712
Low Power Mode Options
713
Chapter 22 Timer Module (TIM16B6CV3)
717
Modes of Operation
718
External Signal Description
719
Functional Description
731
Prescaler
732
Input Capture
733
Resets
734
Chapter 23 Timer Module (TIM16B8CV3)
735
Modes of Operation
736
External Signal Description
739
Register Descriptions
740
Functional Description
756
Prescaler
758
Pulse Accumulator
759
Event Counter Mode
760
Channel [7:0] Interrupt (C[7:0]F)
761
Glossary
764
Block Diagram
765
Chapter 24 16 Kbyte Flash Module (S12FTMRG16K1V1)
763
External Signal Description
766
Memory Map and Registers
767
Register Descriptions
770
Functional Description
787
Allowed Simultaneous P-Flash and EEPROM Operations
792
Flash Command Description
793
Interrupts
807
Wait Mode
808
Unsecuring the MCU in Special Single Chip Mode Using BDM
809
Mode and Security Effects on Flash Command Availability
810
Chapter 25 32 Kbyte Flash Module (S12FTMRG32K1V1)
811
Glossary
812
Block Diagram
813
External Signal Description
814
Memory Map and Registers
815
Register Descriptions
818
Functional Description
837
Internal NVM Resource (NVMRES)
838
MC9S12G Family Reference Manual Rev.1.27 NXP Semiconductors
839
Allowed Simultaneous P-Flash and EEPROM Operations
843
Flash Command Description
844
Interrupts
858
Wait Mode
859
Unsecuring the MCU in Special Single Chip Mode Using BDM
860
Mode and Security Effects on Flash Command Availability
861
Chapter 26 48 Kbyte Flash Module (S12FTMRG48K1V1)
863
Glossary
864
Block Diagram
866
Memory Map and Registers
867
Register Descriptions
871
Functional Description
890
Internal NVM Resource (NVMRES)
891
Allowed Simultaneous P-Flash and EEPROM Operations
896
Flash Command Description
897
Interrupts
911
Wait Mode
912
Unsecuring the MCU in Special Single Chip Mode Using BDM
913
Mode and Security Effects on Flash Command Availability
914
Chapter 27 64 Kbyte Flash Module (S12FTMRG64K1V1)
915
Glossary
916
Block Diagram
917
External Signal Description
918
Memory Map and Registers
919
Register Descriptions
922
Functional Description
941
Internal NVM Resource (NVMRES)
942
Allowed Simultaneous P-Flash and EEPROM Operations
947
Flash Command Description
948
Interrupts
962
Wait Mode
963
Unsecuring the MCU in Special Single Chip Mode Using BDM
964
Mode and Security Effects on Flash Command Availability
965
Chapter 28 96 Kbyte Flash Module (S12FTMRG96K1V1)
967
Glossary
968
Block Diagram
969
External Signal Description
970
Memory Map and Registers
971
Register Descriptions
974
Functional Description
993
Internal NVM Resource (NVMRES)
994
Allowed Simultaneous P-Flash and EEPROM Operations
999
Flash Command Description
1000
Interrupts
1014
Wait Mode
1015
Unsecuring the MCU in Special Single Chip Mode Using BDM
1016
MC9S12G Family Reference Manual Rev.1.27 NXP Semiconductors
1017
Chapter 29 128 Kbyte Flash Module (S12FTMRG128K1V1)
1019
Glossary
1020
Features
1021
External Signal Description
1022
Memory Map and Registers
1023
Register Descriptions
1027
Functional Description
1045
Internal NVM Resource (NVMRES)
1046
Allowed Simultaneous P-Flash and EEPROM Operations
1051
Flash Command Description
1052
Interrupts
1066
Wait Mode
1067
Unsecuring the MCU in Special Single Chip Mode Using BDM
1068
Mode and Security Effects on Flash Command Availability
1069
Chapter 30 192 Kbyte Flash Module (S12FTMRG192K2V1)
1071
Glossary
1072
Block Diagram
1073
External Signal Description
1074
Memory Map and Registers
1075
Register Descriptions
1079
Functional Description
1097
Internal NVM Resource (NVMRES)
1098
Allowed Simultaneous P-Flash and EEPROM Operations
1103
Flash Command Description
1104
Interrupts
1117
Wait Mode
1118
Security
1119
Unsecuring the MCU in Special Single Chip Mode Using BDM
1120
Chapter 31 240 Kbyte Flash Module (S12FTMRG240K2V1)
1123
Glossary
1124
Block Diagram
1125
External Signal Description
1126
Memory Map and Registers
1127
Register Descriptions
1131
Functional Description
1149
Internal NVM Resource (NVMRES)
1150
Allowed Simultaneous P-Flash and EEPROM Operations
1155
Flash Command Description
1156
Interrupts
1169
Wait Mode
1170
Security
1171
Unsecuring the MCU in Special Single Chip Mode Using BDM
1172
Appendix A Electrical Characteristics
1175
A.1 General
1176
A.1.3 Pins
1177
A.1.6 ESD Protection and Latch-Up Immunity
1178
A.1.7 Operating Conditions
1179
A.1.8 Power Dissipation and Thermal Characteristics
1181
A.2 I/O Characteristics
1185
A.3 Supply Currents
1189
A.4 ADC Characteristics
1194
A.4.2 Factors Influencing Accuracy
1195
A.4.3 ADC Accuracy
1196
A.4.4 ADC Temperature Sensor
1206
A.6 DAC Characteristics
1208
A.7.1 Timing Parameters
1209
A.7.2 NVM Reliability Parameters
1214
A.8 Phase Locked Loop
1215
A.8.2 Electrical Characteristics for the PLL
1217
A.10 Electrical Characteristics for the Oscillator (XOSCLCP)
1219
A.11 Reset Characteristics
1220
A.12 Electrical Specification for Voltage Regulator
1221
A.13 Chip Power-Up and Voltage Drops
1223
A.14 Mscan
1224
A.15 SPI Timing
1225
A.15.2 Slave Mode
1227
A.16 ADC Conversion Result Reference
1229
Appendix B Detailed Register Address Map
1231
Appendix C Ordering and Shipping Information
1251
Appendix D Package and die Information
1253
D.1 100 LQFP Mechanical Dimensions
1254
D.2 64 LQFP Mechanical Dimensions
1257
D.3 48 LQFP Mechanical Dimensions
1260
D.4 48 QFN Mechanical Dimensions
1262
D.5 32 LQFP Mechanical Dimensions
1265
D.6 20 TSSOP Mechanical Dimensions
1268
D.7 KGD Information
1271
4
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NXP Semiconductors MC9S12G Specifications
General
Brand
NXP Semiconductors
Model
MC9S12G
Category
Microcontrollers
Language
English
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