NXP Semiconductors MC9S12G - Page 1184

Electrical Characteristics
MC9S12G Family Reference Manual Rev.1.27
1186 NXP Semiconductors
48-pin QFN
22 D
Thermal resistance single sided PCB,
natural convection
2

JA
82 C/W
23 D
Thermal resistance single sided PCB
@ 200 ft/min
3

JMA
67 C/W
24 D
Thermal resistance double sided PCB
with 2 internal planes, natural convection
3

JA
28 C/W
25 D
Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min
3

JMA
23 C/W
26 D Junction to Board
4

JB
11 C/W
27 D Junction to Case
5

JC
N/A C/W
28 D Junction to Package Top
6

JT
4 C/W
64-pin LQFP
29 D
Thermal resistance single sided PCB,
natural convection
2

JA
70 70 70 C/W
30 D
Thermal resistance single sided PCB
@ 200 ft/min
3

JMA
59 58 58 C/W
31 D
Thermal resistance double sided PCB
with 2 internal planes, natural convection
3

JA
52 52 52 C/W
32 D
Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min
3

JMA
46 46 45 C/W
33 D Junction to Board
4

JB
34 34 35 C/W
34 D Junction to Case
5

JC
20 18 17 C/W
35 D Junction to Package Top
6

JT
54N/AC/W
100-pin LQFP
36 D
Thermal resistance single sided PCB,
natural convection
2

JA
61 62 C/W
37 D
Thermal resistance single sided PCB
@ 200 ft/min
3

JMA
51 55 C/W
38 D
Thermal resistance double sided PCB
with 2 internal planes, natural convection
3

JA
49 51 C/W
39 D
Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min
3

JMA
43 47 C/W
40 D Junction to Board
4

JB
34 37 C/W
41 D Junction to Case
5

JC
16 17 C/W
42 D Junction to Package Top
6

JT
3N/AC/W
Table A-5. Thermal Package Characteristics
1
Num C Rating Symbol
S12GN32,
S12GNA32,
S12GN16,
S12GNA16
S12G64,
S12GA64,
S12G48,
S12GN48,
S12GA64
S12G128,
S12GA128,
S12G96,
S12GA96
S12G240,
S12GA240,
S12G192,
S12GA192
Unit