NXP Semiconductors MC9S12G - Page 1274

Package and Die Information
MC9S12G Family Reference Manual Rev.1.27
1276 NXP Semiconductors
88 87 128.5 -1472.06 PS[5]
89 88 14.5 -1472.06 PS[6]
90 89 -99.5 -1472.06 PS[7]
91 90 -213.5 -1472.06 VSSX2
92 91 -318.5 -1472.06 VDDX2
93 92 -428.5 -1472.06 PM[0]
94 93 -548.5 -1472.06 PM[1]
95 94 -688.5 -1472.06 PD[4]
96 95 -828.5 -1472.06 PD[5]
97 96 -998.5 -1472.06 PD[6]
98 97 -1168.5 -1472.06 PD[7]
99 98 -1338.5 -1472.06 PM[2]
100 99 -1518.5 -1472.06 PM[3]
101 100 -1707.5 -1472.06 PJ[7]
Table D-1. Bondpad Coordinates
Die Pad Bond Post
Die Pad
X Coordinate
Die Pad
Y Coordinate
Function