11.3.4 Installing the new processor
Ê Remove the protective cap from the bottom side of the processor.
Ê Install the new processor as described in section "Installing the processor"
on page 245.
11.3.5 Applying the thermal paste to the processor
surface
I – For the Japanese market, the service engineer must follow the
instruction provided separately.
– If the processor replacement kit contains a new heat sink, a thin layer
of thermal compound has already been pre-applied to its lower
surface. In this case, please proceed with section "Installing the heat
sink" on page 257.
Figure 177: Thermal paste syringe
One thermal compound syringe (FTS-FSP:P304000004) contains thermal
paste for three processors.
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