Altera Corporation 13–1
July 2005
13. Package Information for
Stratix Devices
Introduction
This data sheet provides package information for Altera
®
devices. It
includes these sections:
Section Page
Device & Package Cross Reference . . . . . . . . . . . . . . . . . . . . . 13–1
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–2
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13–3
In this data sheet, packages are listed in order of ascending pin count.
Device &
Package Cross
Reference
Table 13–1 shows which Altera Stratix
®
devices are available in BGA,
FineLine BGA and Ultra FineLine BGA packages.
Table 13–1. Stratix Devices in BGA, FineLine BGA & Ultra FineLine BGA
Packages (Part 1 of 2)
Device Package Pins
EP1S10 Flip-chip FineLine BGA 484
BGA 672
FineLine BGA 672
Flip-chip FineLine BGA 780
EP1S20 Flip-chip FineLine BGA 484
BGA 672
FineLine BGA 672
Flip-chip FineLine BGA 780
EP1S25 BGA 672
FineLine BGA 672
Flip-chip FineLine BGA 780
Flip-chip FineLine BGA 1,020
EP1S30 Flip-chip FineLine BGA 780
Flip-chip BGA 956
Flip-chip FineLine BGA 1,020
S53008-3.0