Altera Stratix - Thermal Resistance

13–2 Altera Corporation
Stratix Device Handbook, Volume 2 July 2005
Thermal Resistance
Thermal
Resistance
Table 13–2 provides θ
JA
(junction-to-ambient thermal resistance) and θ
JC
(junction-to-case thermal resistance) values for Altera Stratix devices.
EP1S40 Flip-chip FineLine BGA 780
Flip-chip BGA 956
Flip-chip FineLine BGA 1,020
Flip-chip FineLine BGA 1,508
EP1S60 Flip-chip BGA 956
Flip-chip FineLine BGA 1,020
Flip-chip FineLine BGA 1,508
EP1S80 Flip-chip BGA 956
Flip-chip FineLine BGA 1,020
Flip-chip FineLine BGA 1,508
Table 13–1. Stratix Devices in BGA, FineLine BGA & Ultra FineLine BGA
Packages (Part 2 of 2)
Device Package Pins
Table 13–2. Thermal Resistance of Stratix Devices (Part 1 of 2)
Device Pin Count Package
θ
JC
(° C/W) θ
JA
(° C/W)
Still Air
θ
JA
(° C/W)
100 ft./min.
θ
JA
(° C/W)
200 ft./min.
θ
JA
(° C/W)
400
ft./min.
EP1S10 484 FineLine
BGA
0.38 11.9 9.8 8.4 7.2
672 BGA 3.2 16.8 13.7 11.9 10.5
672 FineLine
BGA
3.4 17.2 14 12.2 10.8
780 FineLine
BGA
0.43 10.9 8.8 7.4 6.3
EP1S20 484 FineLine
BGA
0.30 11.8 9.7 8.3 7.1
672 BGA 2.5 15.5 12.4 10.7 9.3
672 FineLine
BGA
2.7 16 12.8 11 9.6
780 FineLine
BGA
0.31 10.7 8.6 7.2 6.1