Altera Stratix - 780-Pin Fineline BGA - Flip Chip

13–8 Altera Corporation
Stratix Device Handbook, Volume 2 July 2005
Package Outlines
780-Pin FineLine BGA - Flip Chip
■ All dimensions and tolerances conform to ASME Y14.5M - 1994.
■ Controlling dimension is in millimeters.
■ Pin A1 may be indicated by an ID dot, or a special feature, in its
proximity on package surface.
Tables 13–7 and 13–8 show the package information and package outline
figure references, respectively, for the 780-pin FineLine BGA packaging.
Table 13–7. 780-Pin FineLine BGA Package Information
Description Specification
Ordering code reference F
Package acronym FineLine BGA
Substrate material BT
Solder ball composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC outline reference MS-034 variation: AAM-1
Maximum lead coplanarity 0.008 inches (0.20 mm)
Weight 8.9 g
Moisture sensitivity level Printed on moisture barrier bag
Table 13–8. 780-Pin FineLine BGA Package Outline Dimensions
Symbol
Millimeters
Min. Nom. Max.
A––3.50
A1 0.30 – –
A2 0.25 – 3.00
A3 – – 2.50
D 29.00 BSC
E 29.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC