NXP Semiconductors LPC11U3x

UM10462 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2016. All rights reserved.
User manual Rev. 5.5 — 21 December 2016 9 of 523
NXP Semiconductors
UM10462
Chapter 1: LPC11U3x/2x/1x Introductory information
LPC11U22FBD48/301 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2
LPC11U23FBD48/301 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2
LPC11U24FHI33/301 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 5  5  0.85 mm
n/a
LPC11U24FBD48/301 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2
LPC11U24FET48/301 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2
LPC11U24FHN33/401 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 7  7  0.85 mm
n/a
LPC11U24FBD48/401 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2
LPC11U24FBD64/401 LQFP64 plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm SOT314-2
LPC11U34FHN33/311 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 7  7  0.85 mm
n/a
LPC11U34FBD48/311 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2
LPC11U34FHN33/421 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 7  7  0.85 mm
n/a
LPC11U34FBD48/421 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2
LPC11U35FHN33/401 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 7  7  0.85 mm
n/a
LPC11U35FBD48/401 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2
LPC11U35FBD64/401 LQFP64 plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm SOT314-2
LPC11U35FHI33/501 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 5  5  0.
85 mm
n/a
L
PC11U35FET48/501 TFBGA48 plastic thin fine-pitch ball grid array package; 48 balls; body 4.5  4.5
 0.7 mm
SOT1155-2
LPC11U36FBD48/401 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2
LPC11U36FBD64/401 LQFP64 plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm SOT314-2
LPC11U37FBD48/401 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2
LPC11U37HFBD64/401 LQFP64 plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm SOT314-2
LPC11U37FBD64/501 LQFP64 plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm SOT314-2
Table 1. Ordering information
…continued
Type number Package
Name Description Version
Table 2. Part ordering options
Part Number FLASH
(kB)
SRAM
(kB)
(Main
SRAM)
SRAM1
(kB)
USB
SRAM
(kB)
Total
genera
purpose
SRAM
EEPROM
(kB)
USB I2C/
Fast+
SSP ADC
Chan
nels
GPIO
LPC11U12FHN33/201 16 4 - 2 6 N/A 1 1 2 8 26
LPC11U12FBD48/201 16 4 - 2 6 N/A 1 1 2 8 40
LPC11U13FBD48/201 24 4 - 2 6 N/A 1 1 2 8 40
LPC11U14FHI33/201 32 4 - 2 6 N/A 1 1 2 8 26
LPC11U14FHN33/201 32 4 - 2 6 N/A 1 1 2 8 26
LPC11U14FBD48/201 32 4 - 2 6 N/A 1 1 2 8 40
LPC11U14FET48/201 32 4 - 2 6 N/A 1 1 2 8 40
LPC11U22FBD48/301 16 6 - 2 8 1 1 1 2 8 40