NXP Semiconductors LPC11U3x User Manual

UM10462 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2016. All rights reserved.
User manual Rev. 5.5 — 21 December 2016 8 of 523
NXP Semiconductors
UM10462
Chapter 1: LPC11U3x/2x/1x Introductory information
– 12 MHz Internal high-frequency RC oscillator (IRC) that can optionally be used as
a system clock.
– Internal low-power, low-frequency WatchDog Oscillator (WDO) with programmable
frequency output.
– PLL allows CPU operation up to the maximum CPU rate with the system oscillator
or the IRC as clock sources.
– A second, dedicated PLL is provided for USB.
– Clock output function with divider that can reflect the crystal oscillator, the main
clock, the IRC, or the watchdog oscillator.
• Power control:
– Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep
power-down.
– Power profiles residing in boot ROM allow optimized performance and minimized
power consumption for any given application through one simple function call.
– Processor wake-up from Deep-sleep and Power-down modes via reset, selectable
GPIO pins, watchdog interrupt, BOD interrupt, or USB port activity.
– Processor wake-up from Deep power-down mode using one special function pin.
– Integrated PMU (Power Management Unit) to minimize power consumption during
Sleep, Deep-sleep, Power-down, and Deep power-down modes.
– Power-On Reset (POR).
– Brownout detect with four separate thresholds for interrupt and forced reset.
• Unique device serial number for identification.
• Single 3.3 V power supply (1.8 V to 3.6 V).
• Temperature range 40 C to +85 C.
• Available as LQFP64, LQFP48, TFBGA48 packages, and as HVQFN33 in two
package sizes: 5 x 5 x 0.85 mm and 7 x 7 x 0.85 mm.
• Pin-compatible to the ARM Cortex-M3 based LPC134x series.
1.3 Ordering information
Table 1. Ordering information
Type number Package
Name Description Version
LPC11U12FHN33/201 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 7  7  0.85 mm
n/a
LPC11U12FBD48/201 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2
LPC11U13FBD48/201 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2
LPC11U14FHN33/201 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 7  7  0.85 mm
n/a
LPC11U14FHI33/201 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5  5  0.85 mm
n/a
LPC11U14FBD48/201 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2
LPC11U14FET48/201 TFBGA48 plastic thin fine-pitch ball grid array package; 48 balls; body 4.5  4.5
 0.7 mm
SOT1155-2

NXP Semiconductors LPC11U3x Specifications

General

Brand	NXP Semiconductors
Model	LPC11U3x
Category	Microcontrollers
Language	English