5–36 Altera Corporation
Stratix Device Handbook, Volume 2 July 2005
Source-Synchronous Timing Budget
Output t
FALL
LVDS 80 110 120 80 110 120 80 110 120 80 110 120 ps
HyperTransport
technology
110 170 200 110 170 200 110 170 200 110 170 200 ps
LVPECL 90 130 160 90 130 160 100 135 160 100 135 160 ps
PCML 105 140 175 105 140 175 110 145 175 110 145 175 ps
t
DUTY
LVDS (J = 2 through
10)
47.5 50 52.5 47.5 50 52.5 47.5 50 52.5 47.5 50 52.5 %
LVDS (J =1) and
LVPECL, PCML,
HyperTransport
technology
45 50 55 45 50 55 45 50 55 45 50 55 %
t
LOCK
All 100 100 100 100 μs
Notes to Ta b le 5 – 7 :
(1) When J = 4, 7, 8, and 10, the SERDES block is used.
(2) When J = 2 or J = 1, the SERDES is bypassed.
Table 5–8. High-Speed I/O Specifications for Wire-Bond Packages (Part 1 of 3)
Symbol Conditions
-6 Speed Grade -7 Speed Grade -8 Speed Grade
Unit
Min Typ Max Min Typ Max Min Typ Max
f
HSCLK
(Clock frequency)
(LVDS,LVPECL, HyperTransport
technology)
f
HSCLK
= f
HSDR
/ W
W = 4 to 30 (Serdes used) 10 156 10 115.5 10 115.5 MHz
W = 2 (Serdes bypass) 50 231 50 231 50 231 MHz
W = 2 (Serdes used) 150 312 150 231 150 231 MHz
W = 1 (Serdes bypass) 100 311 100 270 100 270 MHz
W = 1 (Serdes used) 300 624 300 462 300 462 MHz
Table 5–7. High-Speed I/O Specifications for Flip-Chip Packages (Part 3 of 3) Notes (1), (2)
Symbol Conditions
-5 Speed Grade -6 Speed Grade -7 Speed Grade -8 Speed Grade
Unit
Min Typ Max Min Typ Max Min Typ Max Min Typ Max