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Dell PowerConnect 5324 User Manual

Dell PowerConnect 5324
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76 Configuring System Information
www.dell.com | support.dell.com
Defining General Device Information
The
General
page
contains links to pages for configuring device parameters.
Viewing the Asset Page
The
Asset
page contains parameters for configuring general device information, including the
system name, location, and contact, the system MAC Address, System Object ID, date, time, and
System Up Time. To open the
Asset
page, click
System
General
Asset
in the tree view.
Figure 6-16. Asset
System Name (0-160 Characters)
— Defines the user-defined device name.
System Contact (0-160 Characters)
— Specifies the name of the contact person.
System Location (0-160 Characters)
— Specifies the location where the system is currently
running.
MAC Address
— Specifies the device MAC address.
Sys Object ID
— Specifies the vendor's authoritative identification of the network management
subsystem contained in the entity.
Service Tag
— Specifies the service reference number used when servicing the device.
Asset Tag (0-16 Characters)
— Specifies the user-defined device reference.
Serial No.
— Specifies the device serial number.
Date ( /YY
) — Specifies the current date. The format is month, day, year, for example,
11/10/02 is November 10, 2002.
Time (HH:MM:SS)
— Specifies the time. The format is hour, minute, second, for example,

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Dell PowerConnect 5324 Specifications

General IconGeneral
Switching Capacity48 Gbps
VLAN SupportYes
Rack MountableYes
Device TypeSwitch
MAC Address Table Size8K entries
RAM64 MB
Flash Memory8 MB
Power DeviceInternal power supply
Voltage RequiredAC 120/230 V (50/60 Hz)
Jumbo Frame SupportYes
Ports24 x 10/100/1000 + 2 x SFP
ManagementWeb-based, SNMP, CLI
Enclosure TypeRack-mountable
Routing ProtocolStatic IP routing
Remote Management ProtocolSNMP 1, 2, 3
FeaturesFlow control, auto-negotiation, port mirroring, Quality of Service (QoS)
Compliant StandardsIEEE 802.3, IEEE 802.3u, IEEE 802.3ab, IEEE 802.3x
Operating Temperature0 °C to 45 °C
Storage Temperature-20 °C to 70 °C
Humidity5% to 95% (non-condensing)
LayerLayer 2

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