Attention: The pins on the socket are fragile. Any damage to the pins may
require replacing the system board.
11. If you are instructed to return the microprocessor, follow all packaging
instructions, and use any packaging materials for shipping that are supplied to
you.
Installing a microprocessor and heat sink
IBM authorized service providers can remove and replace a microprocessor and
heat sink in the file module. The following procedure is for a field replaceable unit
(FRU). FRUs must be installed only by trained service technicians.
About this task
The following notes describe the type of microprocessor that the file module
supports and other information that you must consider when you install a
microprocessor and heat sink:
v Microprocessors are to be installed only by trained service technicians.
v A 2073-720 file module supports one (1) microprocessor. See Parts listing for
2073-720 file modules.
v The microprocessor must always be installed in microprocessor socket 1 on the
system board.
v The air baffle must be installed to provide proper system cooling.
v If you have to replace the microprocessor, call IBM Remote Technical Support for
service.
v If the thermal-grease protective cover (for example, a plastic cap or tape liner) is
removed from the heat sink, do not touch the thermal grease on the bottom of
the heat sink or set down the heat sink. For more information about applying or
working with thermal grease, see “Removing and replacing the thermal grease”
on page 174.
Note: Removing the heat sink from the microprocessor destroys the even
distribution of the thermal grease and requires replacing the thermal grease.
To install an additional microprocessor and heat sink, complete the following steps:
Procedure
1. Read the Safety information and “Installation guidelines” on page 94.
2. Follow the procedure in “Removing a file module and disconnecting power”
on page 92 to suspend the file module from the cluster and shut it down, and
then disconnect all power cords and external cables.
Attention: When you handle static-sensitive devices, take precautions to
avoid damage from static electricity. For details about handling these devices,
see “Handling static-sensitive devices” on page 96.
3. Remove the cover (see “Removing the cover” on page 123).
4. Remove the following components, if necessary:
v PCI riser-card assembly 1 (see “Removing a PCI riser-card assembly” on
page 141)
v DIMM air baffle (see “Removing the air baffle” on page 137)
5. Rotate the heat sink release lever to the open position.
170 Storwize V7000 Unified: Problem Determination Guide 2073-720
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