Intel D50DNP Series - Module and Chassis Specific Features; Table 5. 1 U Compute Module Specific Features

Intel® Server D50DNP Family Integration and Service Guide
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6.6 Module and Chassis Specific Features
Intel® Server Board D50DNP1SB defines many characteristics of the modules. The following tables show
module-specific characteristics only. Refer to the board specification table in the previous section for
common family features.
Table 5. 1U Compute Module Specific Features
Feature Description
Maximum
Processor Thermal
Design Power (TDP)
• Up to 350 W (D50DNP1MHCPLC)
• Up to 270 W (D50DNP1MHEVAC)
• Up to 250 W (D50DNP1MHCPAC)
Memory Support
• Up to 16 DDR5 RDIMMs or 8 DDR5 RDIMMs plus 8 Intel® Optane™ PMem 300 series modules in air-
cooled modules
• 16 DDR5 RDIMMs in liquid-cooled modules
Expansion Options
Riser Slots
Riser Slot 1 supports 1U single PCIe* slot riser card assembly (iPC DNP1UMRISER)
• with single PCIe 5.0 x16 slot supporting one low profile PCIe add-in card.
• PCIe 5.0 lanes routed from CPU 1 through an MCIO* cable.
Riser Slot 2 supports 1U single PCIe slot riser card assembly (iPC DNP1URISER)
• with single PCIe 5.0 x16 slot supporting one low profile PCIe add-in card.
• PCIe 5.0 lanes routed from CPU 0.
• D50DNP1MHEVAC does not support a low-profile PCIe add-in card in Riser Slot 2 because the EVAC
extension occupies this space. M.2 SSD is still supported in Riser Slot 2.
• Each 1U riser can accommodate one SATA or PCIe 3.0 NVMe* 80/110mm M.2 SSD drive. SATA and PCIe
lanes are routed from the Intel® C741 chipset
• The PCIe slots in 1U riser cards provide up to 25 W of power.
• PCIe lanes routed from processor/chipset support Intel® VMD.