Intel® Server D50DNP Family Integration and Service Guide
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7.5.6 Riser Assembly Installation into Liquid-Cooled Modules
The liquid-cooled modules D50DNP1MHCPLC and D50DNP1MFALLC use the same riser assemblies that are
used for air-cooled modules. The procedures describing riser assmply installation into air-cooled modules
(Section 7.5.4 or Section 7.5.5) should be followed for liquid-cooled modules. But there is one important
difference that customers must observe.
There are three thin thermal pad strips attached to the conduction plates around each riser card slot. These
strips conduct the heat from the M.2 SSD via the cold plate and riser bracket on the riser card. These strips
are made from a sticky thermal interface material and they stick to both surfaces they contact: to the cooling
loop conduction plate on one side and to the M.2 SSD cold plate and riser bracket on another side. These
thin strips can be easily damaged and/or displaced when a riser assembly is removed. If they displaced
crossing the riser slot and a user does not notice that when installing the riser assembly, the thermal pad will
be jammed into the riser slot making it inoperable. The server board replacement will be required to restore
the system.
Before installing a riser assembly into a liquid-cooled module, make sure these thermal pads are attached to
the conduction plate in their designated places and do not cross the riser slot.
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