Intel D50DNP Series - Page 234

Intel® Server D50DNP Family Integration and Service Guide
234
Appendix H. Glossary
Term
Definition
1U
One rack unit (1.75 inches)
2U
Two rack units (3.5 inches)
ADR
Asynchronous DRAM
BIOS
Basic input output system; non-volatile firmware
BMC
Baseboard management controller
CDU
Coolant distribution unit
Chassis
Casing containing the server modules and fans/liquid-cooling plumbing
DIMM
Dual inline memory module
EFI
Extensible Firmware Interface
EMP module
Ethernet management port module
ESD
Electrostatic discharge
FRU
Field replacement unit
MCIO*
Mini cool edge I/O
PHM
Processor heat sink module
MRC
Memory reference code
NVMe*
Non-Volatile Memory Express
OAM*
Open Compute Project* (OCP*) Accelerator Module
OOB
Out of band
PCIe*
Peripheral Component Interconnect Express*
PDB
Power distribution board
POST
Power-on self-test
PTH
Plated through hole
Rack
Casing containing one or multiple chassis
SDR
Sensor data record
SEL
System event log
SSD
Solid state drive
SUP
System update package
SMT
Surface-mount technology
TIM
Thermal interface material
VR
Voltage regulator