Intel D50DNP Series - Page 9

Intel® Server D50DNP Family Integration and Service Guide
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3.4.4 Standard Riser Assembly Installation .................................................................................................................... 68
3.4.5 MCIO* Riser Assembly Installation ......................................................................................................................... 69
3.4.6 Riser Assembly Installation into Liquid-Cooled Modules ............................................................................. 70
3.5 Liquid-Cooled Add-In Card Installation (D50DNP1MHCPLC and D50DNP1MFALLC Modules) .. 71
3.6 PCIe* Accelerator Module Add-In Card Installation (D50DNP2MFALAC Module) ............................. 72
3.7 2.5” U.2 Front Drive Installation ............................................................................................................................... 78
3.7.1 Drive Carrier Extraction ................................................................................................................................................ 78
3.7.2 Drive Carrier Assembly ................................................................................................................................................ 78
3.7.3 Drive Carrier Installation ............................................................................................................................................. 80
3.8 M.2 SSD Installation ...................................................................................................................................................... 81
3.8.1 Thermal Pad Installation for Air-Cooled Configurations ............................................................................... 81
3.8.2 M.2 SSD Installation for Air-Cooled Configurations ........................................................................................ 82
3.8.3 M.2 SSD Heat Sink Installation for Air-Cooled Configurations ................................................................... 83
3.8.4 Riser Bracket Installation for Liquid-Cooled Configurations ....................................................................... 83
3.8.5 Thermal Pad Installation for Liquid-Cooled Configurations ........................................................................ 84
3.8.6 M.2 SSD Installation for Liquid-Cooled Configurations ................................................................................. 85
3.8.7 M.2 SSD Cold Plate Installation for Liquid-Cooled Configurations .......................................................... 86
3.9 Trusted Platform Module (TPM) Installation ...................................................................................................... 87
3.10 Ethernet Management Port Module (AXXFCEMP) ........................................................................................... 88
4. System Software Updates and Configuration .................................................................................................... 89
4.1 Using the BIOS Setup Utility ...................................................................................................................................... 89
4.1.1 Entering BIOS Setup Utility ........................................................................................................................................ 89
4.1.2 No Access to the BIOS Setup Utility ....................................................................................................................... 89
4.1.3 Navigating the BIOS Setup Utility ............................................................................................................................ 89
5. System Packaging Assembly Instructions .......................................................................................................... 91
6. System / Module Features Overview ................................................................................................................... 94
6.1 System Feature Identification ................................................................................................................................... 94
6.2 Front Panel Feature Identification .......................................................................................................................... 96
6.3 Front Control Panel and I/O Breakout Cable Feature Identification ........................................................ 97
6.4 System Component Identification .......................................................................................................................... 98
6.5 Server Board Features ............................................................................................................................................... 104
6.6 Module and Chassis Specific Features ............................................................................................................... 107
7. FRU Replacement ................................................................................................................................................... 111
7.1 Module Removal / Installation ............................................................................................................................... 112
7.1.1 Module Removal .......................................................................................................................................................... 112
7.1.2 Module Installation ..................................................................................................................................................... 112
7.2 Air Duct Removal / Installation .............................................................................................................................. 113
7.2.1 Air Duct Removal (Half Width Modules) ............................................................................................................ 113
7.2.2 Air Duct Installation (Half Width Modules) ....................................................................................................... 113
7.2.3 Air Duct Removal (D50DNP2MFALAC Module) .............................................................................................. 114
7.2.4 Air Duct Installation (D50DNP2MFALAC Module) ......................................................................................... 114
7.3 Processor Replacement ............................................................................................................................................ 115