Siemens Simatic S7 Series System Manual

Installation
3.1 Guidelines for installing S7-200 SMART devices
S7-200 SMART
38 System Manual, 09/2015, A5E03822230-AC
Provide adequate clearance for cooling and wiring
S7-200 SMART devices are designed for natural convection cooling. For proper cooling, you
must provide a clearance of at least 25 mm above and below the devices. Also, allow at
least 25 mm of depth between the front of the modules and the inside of the enclosure.
CAUTION
Temperature considerations
Vertical mounting reduces the maximum allowable ambient temperature by 10 degrees C.
Operating outside the maximum temperature range could result in erratic process operation
and could result in minor personal injury.
Mount the CPU below any expansion modules, as shown in the following figure. Follow the
prescribed guidelines for mounting modules to ensure proper cooling.
①
Side view
③
Vertical installation
②
Horizontal installation
④
Clearance area
When planning your layout for the PLC, allow enough clearance for the wiring and
communications cable connections.

Siemens Simatic S7 Series Specifications

General

CPU	Varies by model (e.g., S7-300, S7-400, S7-1200, S7-1500)
Communication Interfaces	PROFIBUS, PROFINET, Ethernet, MPI
Programming	TIA Portal, STEP 7
Programming Languages	LAD, FBD, STL, SCL, GRAPH
I/O Modules	Digital, Analog, Specialty modules available
Operating Temperature	0°C to 60°C (standard models)
Mounting	DIN rail mounting
Operating Voltage	24V DC or 120/230V AC (varies by model)
Protection Class	IP20 (standard models)
Memory	Varies depending on the S7 model. Includes work memory (RAM) for program execution, load memory (EEPROM or Flash) for program storage, and system memory for operating system functions. Memory sizes range from kilobytes to megabytes.