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Olympus BondMaster 600 - Inspecting Metal-to-Metal Bonds - Resonance Technique

Olympus BondMaster 600
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DMTA-10045-01EN, Rev. E, August 2016
Applications
137
Figure 621 The list of all parameters
6.1.3 Detecting Smaller Disbonds in Honeycomb Composite — Mechanical
Impedance Analysis (MIA) Technique
The smaller tips of the MIA probes, combined with the expanded frequency range of
the BondMaster 600, are ideal for detecting smaller defects in honeycomb composites.
This procedure demonstrates how to use the MIA test mode to detect defects in
honeycomb composite assemblies using a suggested test frequency. A more advanced
procedure for determining the best test frequency for your particular situation is
explained in “Finding the Best Frequency to Inspect Honeycomb Composite —
Mechanical Impedance Analysis (MIA) Technique” on page 166.
Inspection materials are shown in Figure 6-22 on page 138.

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