Olympus BondMaster 600 - Detecting Repaired Areas (Potting) in Honeycomb Composite - Mechanical Impedance Analysis (MIA) Technique; Figure 6-28 the List of All Parameters; Figure 6-29 Materials - Repaired Areas (Potting) Using MIA Technique

DMTA-10045-01EN, Rev. E, August 2016
Chapter 6 142
Figure 6‑28 The list of all parameters
6.1.4 Detecting Repaired Areas (Potting) in Honeycomb Composite —
Mechanical Impedance Analysis (MIA) Technique
As MIA technology measures the mechanical impedance (or stiffness) of materials, it
displays a high contrast between a repaired/potted area (which is stiff) and a disbond
(which has low mechanical resistance). This contrast characteristic allows you to use
the MIA test technique to identify repaired areas in honeycomb composite.
Inspection materials are shown in Figure 6-29 on page 142.
Figure 6‑29 Materials — repaired areas (potting) using MIA technique