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Need help?Do you have a question about the Olympus BondMaster 600 and is the answer not in the manual?
Specifies the intended purpose of the BondMaster 600 composite bond tester.
Guidance on reviewing and keeping the instruction manual for safe operation.
Lists compatible ancillary equipment for the BondMaster 600.
States that the instrument has no user-serviceable parts and opening voids warranty.
Explains the meaning of general warning and shock hazard symbols.
Explains the significance of DANGER, WARNING, and CAUTION signal words.
General warnings for instrument operation and safety precautions.
Warning about connecting to the correct power source and using authorized cords.
Precautions for handling, charging, and disposing of lithium-ion batteries.
Explains how the BondMaster 600 works and the various test techniques used.
Instructions for unpacking and inspecting the instrument and its contents.
Lists key accessories and components included with the BondMaster 600.
Illustrates and describes the various connectors on the BondMaster 600.
Details the different methods for powering the BondMaster 600 instrument.
Information about the provided charger/adaptor and its indicator light.
Describes the battery compartment, its cover, and safety features.
Details the lithium-ion battery, its expected life, and charging requirements.
Instructions for installing a microSD memory card for data storage.
Describes the front panel layout, keypad, and the SmartKnob control.
Explains the BondMaster 600 keypad configurations and key functions.
Describes the 11-pin Fischer PROBE connector located on the top of the instrument.
Details the I/O and VGA OUT connectors located on the back of the instrument.
Explains the microSD slot and USB port behind the I/O door.
Details the instrument's IP66 ingress protection rating and maintenance.
Describes the two startup modes based on probe connection.
Instructions for navigating the application menu and selecting applications.
Describes the PowerLink feature for automatic probe recognition and setup.
Procedure for detecting disbonds in flat honeycomb composites using PC RF/IMPULSE.
Procedure for inspecting tapered honeycomb composites with PC Swept technique.
Procedure for detecting small defects using MIA probes and expanded frequency range.
Using MIA to identify repaired/potted areas based on mechanical impedance contrast.
Procedure for inspecting metal-to-metal bonds using the resonance mode.
Calibrating resonance mode for detecting interply delamination as a go/no-go test.
Steps for upgrading the BondMaster 600 instrument software via USB connection.
Specifies the intended purpose of the BondMaster 600 composite bond tester.
Guidance on reviewing and keeping the instruction manual for safe operation.
Lists compatible ancillary equipment for the BondMaster 600.
States that the instrument has no user-serviceable parts and opening voids warranty.
Explains the meaning of general warning and shock hazard symbols.
Explains the significance of DANGER, WARNING, and CAUTION signal words.
General warnings for instrument operation and safety precautions.
Warning about connecting to the correct power source and using authorized cords.
Precautions for handling, charging, and disposing of lithium-ion batteries.
Explains how the BondMaster 600 works and the various test techniques used.
Instructions for unpacking and inspecting the instrument and its contents.
Lists key accessories and components included with the BondMaster 600.
Illustrates and describes the various connectors on the BondMaster 600.
Details the different methods for powering the BondMaster 600 instrument.
Information about the provided charger/adaptor and its indicator light.
Describes the battery compartment, its cover, and safety features.
Details the lithium-ion battery, its expected life, and charging requirements.
Instructions for installing a microSD memory card for data storage.
Describes the front panel layout, keypad, and the SmartKnob control.
Explains the BondMaster 600 keypad configurations and key functions.
Describes the 11-pin Fischer PROBE connector located on the top of the instrument.
Details the I/O and VGA OUT connectors located on the back of the instrument.
Explains the microSD slot and USB port behind the I/O door.
Details the instrument's IP66 ingress protection rating and maintenance.
Describes the two startup modes based on probe connection.
Instructions for navigating the application menu and selecting applications.
Describes the PowerLink feature for automatic probe recognition and setup.
Procedure for detecting disbonds in flat honeycomb composites using PC RF/IMPULSE.
Procedure for inspecting tapered honeycomb composites with PC Swept technique.
Procedure for detecting small defects using MIA probes and expanded frequency range.
Using MIA to identify repaired/potted areas based on mechanical impedance contrast.
Procedure for inspecting metal-to-metal bonds using the resonance mode.
Calibrating resonance mode for detecting interply delamination as a go/no-go test.
Steps for upgrading the BondMaster 600 instrument software via USB connection.
General| Operating Temperature | -10°C to 50°C (14°F to 122°F) |
|---|---|
| Display | 5.7-inch VGA color LCD |
| Battery Life | Up to 8 hours |
| Storage Temperature | -20 °C to 60°C |
| Data Storage | Internal memory, USB |
| Interface | USB |
