Olympus BondMaster 600 - Instrument Compatibility; Repair and Modification

DMTA-10045-01EN, Rev. E, August 2016
Table of Contents vi
6. Applications .............................................................................................. 121
6.1 Common BondMaster 600 Applications .............................................................. 122
6.1.1 Detecting Skin-to-Core Disbonds in Honeycomb Composite
— Flat or Constant Geometry Using PC RF or IMPULSE Techniques . 122
6.1.2 Detecting Skin-to-Core Disbonds in Honeycomb Composite
— Tapered or Varying Geometry Using PC Swept Technique .............. 133
6.1.3 Detecting Smaller Disbonds in Honeycomb Composite
— Mechanical Impedance Analysis (MIA) Technique ........................... 137
6.1.4 Detecting Repaired Areas (Potting) in Honeycomb Composite
— Mechanical Impedance Analysis (MIA) Technique ........................... 142
6.1.5 Inspecting Metal-to-Metal Bonds — Resonance Technique ................... 147
6.1.6 Detecting Interply Delamination in Composites
— General Procedure Using Resonance Technique ................................ 153
6.2 Advanced Guide for OEM Procedure and Application Development Using
the BondMaster 600 ................................................................................................ 160
6.2.1 Analyzing Frequency Response in Honeycomb Composite —
Selecting the Best Inspection Frequency Using PC Swept Technique .. 160
6.2.2 Finding the Best Frequency to Inspect Honeycomb Composite
— Mechanical Impedance Analysis (MIA) Technique ........................... 166
7. BondMaster PC Software ....................................................................... 173
7.1 USB Communication .............................................................................................. 173
7.2 Screen Capture Using BondMaster PC ................................................................ 173
7.3 Instrument Software Upgrade .............................................................................. 175
7.4 PDF Creation ........................................................................................................... 178
7.5 Commands ............................................................................................................... 180
7.6 Remote Control ....................................................................................................... 194
7.7 File Manager ............................................................................................................ 196
7.8 Unlock Options ....................................................................................................... 200
7.9 Backup ...................................................................................................................... 201
7.10 Restore ...................................................................................................................... 203
8. Maintenance and Troubleshooting ...................................................... 207
8.1 Lithium-Ion Battery ................................................................................................ 207
8.2 Probe Care and Diagnostics .................................................................................. 208
Appendix A: Specifications ......................................................................... 209
A.1 General and Environmental Specifications ......................................................... 209
A.2 Input/Output Specifications .................................................................................. 211
A.3 Bond Testing Specifications ................................................................................... 213
A.4 Pitch-Catch Tone Burst and Swept Mode Specifications .................................. 214