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Olympus BondMaster 600 - Pitch-Catch Tone Burst and Swept Mode Specifications

Olympus BondMaster 600
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DMTA-10045-01EN, Rev. E, August 2016
Appendix A
214
A.4 Pitch-Catch Tone Burst and Swept Mode Specifications
Table 13 on page 215 provides the pitch-catch tone burst and swept mode
specifications.
Bond testing
characteristics
Types Pitch-catch (PC), mechanical
impedance analysis (MIA), and
resonance probes. The BondMaster 600
is fully compatible with BondMaster
PowerLink and non-PowerLink probes,
as well as other main probe and
accessory suppliers.
Gain 0dB to 100dB, in 0.1dB or 1dB
increments. Certain test modes have
limitations within this range.
Rotation 0° to 359.9° in 0.1° or 1° increments
Scan Variable from 0.520 s to 40 s. Certain
screen configurations have limitations
within this range.
Low-pass filter 6 Hz to 300 Hz. Certain test modes
have limitations within this range.
Probe drive LOW, MEDIUM, and HIGH user-
adjustable settings.
Variable persistence 0.1 s to 10 s
Variable display erase 0.1 s to 60 s
Table 12 Bond testing specifications (continued)
Category Parameter Va lu e

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