Olympus BondMaster 600 - Figure 6-55 Materials - Analyzing Frequency Response Using PC Swept

DMTA-10045-01EN, Rev. E, August 2016
Applications 161
Figure 6‑55 Materials — analyzing frequency response using PC Swept
The following products are used in this procedure:
• Honeycomb composite reference standard: 25 mm (1 in.) thick, twelve 3-plies
fiberglass top and bottom skins, Nomex and fiberglass cores. Includes two 25 mm
(1 in.) disbonds, two 25 mm (1 in.) delaminations and two 25 mm (1 in.) repairs.
P/N: CHRS-1-3 [U8860626]
• Cable for pitch-catch and MIA modes, 1.83 m (6 ft).
P/N: SBM-CPM-P11 [U8800058]
• Pitch-catch probe for general use; tip spacing 14 mm. P/N: S-PC-P14 [U8800601]
To set the initial BondMaster 600 configuration
1. Connect the probe and the cable to the PROBE connector of the BondMaster 600.
2. When prompted, press CONTINUE (A key) to accept the PowerLink probe
information.
If you are using a non-PowerLink probe, access the APPL SELECT menu (A key)
using the ADV SETUP menu key ( ).
NOTE