Olympus BondMaster 600 - Page 247

DMTA-10045-01EN, Rev. E, August 2016
Index 237
precautions 9
signal words 7
symbols 7
warnings
AC power cord 26, 29
charger/adaptor 30
saving selected values 114
screen auto erase 66
screen capture
BondMaster PC 173
instrument 72
seals, membrane 49
selecting and saving values 114
selection, menu 55
serial number
format 4
label content 4
location 2
settings 113
all settings menu 56
auto erase, screen 66
clock 64
crosshairs, screen 67
display brightness 65
instrument initial setup 63
startup screen 67
setup
advanced 112
quick (instrument) 53, 113
signal words
information notes 8
IMPORTANT 8
NOTE 8
TIP 8
safety 7
CAUTION 8
DANGER 7
WARNING 8
skin-to-core disbonds
flat geometry 122
tapered or varying geometry 133
slot, microSD 27, 37, 48
smaller disbonds (MIA technique) 137
SmartKnob 39
software
menu navigation 53
menus 73
PC 173
PowerLink menu 53
upgrade 175
user interface 51
specifications
alarms 217
bond testing 213
connectivity 217
general and environmental 209
input/output 212
interface 218
mechanical impedance analysis mode 216
memory 217
pitch-catch swept mode 214
pitch-catch tone burst mode 214
resonance mode 216
stand, instrument 39, 49
startup 51
application choices 51
PowerLink probes 69
screen selection 67
status, power indicator 32
support information, technical 15
symbols 1
CE 4
direct current 3
Korean standard 3
membrane vent 3
RCM (Australia) 3
RoHS 4, 12, 13
safety 7
warning 4
WEEE 3
T
technical support 15
text editor, memory 109
thumb screws, battery compartment cover 33
time, setting 64
TIP signal word 8
U
unlock options 115, 200
unpacking, cartons 19
upgrades