Electrical Characteristics
322 Datasheet
CLKOUT_PCIE[7:0]_[P,N], CLKOUT_DMI_[P,N], CLKOUT_PEG_[B:A]_[P,N],
CLKOUT_ITPXDP_[P,N]
Period Period SSC On 9.849 10.201 ns 8-30
Period Period SSC Off 9.849 10.151 ns 8-30
DtyCyc Duty Cycle 40 60 % 8-30
V_Swing Differential Output Swing 300 — mV 8-30
Slew_rise Rising Edge Rate 1.5 4 V/ns 8-30
Slew_fall Falling Edge Rate 1.5 4 V/ns 8-30
Jitter — 150 ps 8,9,10
SSC Spread Spectrum 0 0.5 % 13,14
SMBus/SMLink Clock (SMBCLK, SML[1:0]CLK)
f
smb
Operating Frequency 10 100 KHz
t22 High time 4.0 50 s 28-20
t23 Low time 4.7 — s 8-20
t24 Rise time — 1000 ns 8-20
t25 Fall time — 300 ns 8-20
SMLink0 Clock (SML0CLK) (See note 15)
f
smb
Operating Frequency 0 400 KHz
t22_SML High time 0.6 50 s 28-20
t23_SML Low time 1.3 — s 8-20
t24_SML Rise time — 300 ns 8-20
t25_SML Fall time — 300 ns 8-20
HDA_BCLK (Intel
®
High Definition Audio)
f
HDA
Operating Frequency 24.0 MHz
Frequency Tolerance — 100 ppm
t26a
Input Jitter (refer to Clock Chip
Specification)
— 300 ppm
t27a High Time (Measured at 0.75 Vcc) 18.75 22.91 ns 8-11
t28a Low Time (Measured at 0.35 Vcc) 18.75 22.91 ns 8-11
Suspend Clock (SUSCLK)
f
susclk
Operating Frequency 32 kHz 4
t39 High Time 10 — s 4
t39a Low Time 10 — s 4
XTAL25_IN/XTAL25_OUT
ppm
12
CrystalTolerance cut accuracy max 35ppm(@ 25 °C +/- 3C)
ppm
12
TempStability max 30ppm(10 °C to 70°C)
ppm
12
Aging Max 5ppm
Table 8-24. Clock Timings (Sheet 3 of 4)
Sym Parameter Min Max
Unit
Notes Figure
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