Datasheet 845
Thermal Sensor Registers (D31:F6)
22 Thermal Sensor Registers
(D31:F6)
22.1 PCI Bus Configuration Registers
Table 22-1. Thermal Sensor Register Address Map
Offset Mnemonic Register Name Default Type
00h–01h VID Vendor Identification 8086h RO
02h–03h DID Device Identification 1C24h RO
04h–05h CMD Command Register 0000h R/W, RO
06h–07h STS Device Status 0010h R/WC, RO
08h RID Revision ID 00h RO
09h PI Programming Interface 00h RO
0Ah SCC Sub Class Code 80h RO
0Bh BCC Base Class Code 11h RO
0Ch CLS Cache Line Size 00h RO
0Dh LT Latency Timer 00h RO
0Eh HTYPE Header Type 00h RO
0Fh BIST Built-in Self Test 00h RO
10h–13h TBAR Thermal Base Address (Memory) 00000004h R/W, RO
14h–17h TBARH Thermal Base Address High DWord 00000000h RO
2Ch–2Dh SVID Subsystem Vendor Identifier 0000h R/WO
2Eh–2Fh SID Subsystem Identifier 0000h R/WO
34h CAP_PTR Capabilities Pointer 50h RO
3Ch INTLN Interrupt Line 00h R/W
3Dh INTPN Interrupt Pin
See
Description
RO
40h–43h TBARB BIOS Assigned Thermal Base Address 00000004h R/W, RO
44h–47h TBARBH
BIOS Assigned Thermal Base High
DWord
00000000h R/W
50h–51h PID PCI Power Management Capability ID 0001h RO
52h–53h PC Power Management Capabilities 0023h RO
54h–57h PCS Power Management Control and Status 0008h R/W, RO