GE
P
ART NUMBER FN091065, REVISION 2 VS5 N AND VS6 N SERVICE MANUAL
8-160 Section 8-6 - Lower Section Components Replacement Procedures
PRELIMINARY
8-6-10-5 TR32 and RFI Boards Installation Procedure
NOTE: This procedure applies to replacement of one or more of the defective boards (TR32A and/or TR32B
and/or RFI).
1) Prepare each of the two TR32 Boards, as follows:
a.) Apply a small quantity of heat sink paste (Dow Corning
®
340 Heat Sink Compound, or similar)
to each of the ten areas shown in Figure 8-199 (marked with arrows).
b.) Attach the TR32 Board to its respective heat sink pad by placing the heat sink on the TR32
Board (the obverse side of the heat sink is shown in Figure 8-200).
When performing these procedures, take precautions to avoid damage
of electrostatic-sensitive components. Always have the ESD wrist strap
connected either to the DIB chassis or to the GND plug at the rear of
the scanner, and to your hand.
Figure 8-199 TR32 Board Showing Areas for Application of Heat Sink Paste
Figure 8-200 TR32 Board Shown with Respective Heat Sink Pad