32 Rockwell Automation Publication 2198-UM004A-EN-P - October 2019
Chapter 2 Plan and Install the Kinetix 5100 Drive System
Bonding Multiple Subpanels
Bonding multiple subpanels creates a common low-impedance exit path for the
high frequency energy inside the cabinet. Subpanels that are not bonded together
do not necessarily share a common low-impedance path. This difference in
impedance can affect networks and other devices that span multiple panels.
• Bond the top and bottom of each subpanel to the cabinet by using
25.4 mm (1.0 in.) by 6.35 mm (0.25 in.) wire braid. As a rule, the wider
and shorter the braid is, the better the bond.
• Scrape the paint from around each fastener to maximize metal-to-metal
contact.
Figure 13 - Multiple Subpanels and Cabinet Recommendations
Wire Braid.
25.4 mm (1.0 in.) by
6.35 mm (0.25 in.)
Remove paint
from cabinet.
Ground bus that is bonded
to the subpanel.
Wire Braid.
25.4 mm (1.0 in.) by
6.35 mm (0.25 in.)
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