REV 0, June 2005 Page 101
Operation Manual SUPREMA
5. Installation
Solder bridges BR101 and BR102 are on the solder side of the MCI module and are usually
covered by a barcode sticker. This must be removed if it is necessary to change the configuration.
The solder bridges must be configured as shown in the following table:
Warning: Passive sensors should never be connected to an MCI module, as this
may cause the destruction of the sensors and/or the MAI/MCI modules.
Configuration of the MPI Module (Passive Sensors)
Variously equipped MPI modules are provided for the various types of passive sensors. The
circuit board is the same, but the components mounted on it are different. The modules are
characterised by the sensors they are designed to accept.
Note: Provisions have been made for the connection of MSA sensors only.
Table 5-10: Types of MPI Modules
5.3.4 Configuration of the MAT Module
Two solder bridges are provided for each input on the bottom of the circuit board for 3 or 5 wire
operation of the sensors:
Solder bridge OPEN = 5 wire operation
Solder bridge CLOSED = 3 wire operation
Note: The solder bridges for 3 wire operation must be closed only when passive
sensors (MPI module) are connected. For 5 wire operation with active sensors
(MCI module), the solder bridges must be open!
Type of Sensor BR101 BR102 Notes
4 ... 20 mA (3-wire)
4 ... 20 mA (2-wire) open open Standard configuration
0 ... 24 V (2-wire)
volt-free contact
0 ... 100 mV closed closed
Table 5-9: MCI 10 module configuration
Configuration of MCI 20
No configuration
Configuration of MCI 20 BFE
No configuration
Module Type Type of Sensor
MPI-WT100 D-7600/D-7602/D-7100/D-7711/D-715/D-7152/TYP 410/Sensor 47K
MPI-WT10 D-7010
MPI-HL8101 D-8101/D-8201
MPI-HL8113 D-8113/D-8213
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