Operations and Maintenance Manual Mechanical Description
Version 1.2 - June 2004 4 - 9
SPIN-RINSE STATION
Note: The times included in the description below are approximate--all times are
process-oriented and variable.
With the spin-rinse station's spindle in up position, the robot releases the wafer onto the
spindle. Vacuum is then turned on at the vacuum chuck in preparation for holding the
wafer in place. The spindle then lowers down into the pan.
When the spindle moves down, a programmable variable speed servo motor turns on,
rotating the wafer. Lowered by a pneumatic cylinder, the lid moves down. The lid
contains two D.I. water nozzles and a small articulated bristle brush. The two D.I. water
nozzles spray for ten seconds, cleaning grinding residue off the wafer. The brush then
moves from the edge of the wafer to its center and back and forth. After cleaning, clean
dry air or nitrogen is blown on the wafer during the spin dry segment of the cycle to
accelerate drying. During cleaning the spindle rotates at a relatively low RPM; during
drying it rotates at approximately 4000 RPM.
After cleaning and drying, the lid retracts up, the chuck moves up, and vacuum is turned
off, releasing the wafer. The robot then picks up the wafer.
SEND 1, SEND 2, RECEIVE 1, RECEIVE 2 CASSETTE ACCESS
TURRET ASSEMBLIES
The four cassette turret assemblies are functionally identical. A selection at the touch
screen of the control computer monitor requests rotation of each platform. The rotary
actuator under the cassette turret rotates the turret platform 180°, smoothly presenting
the cassette to the robot or to the operator. The cassette platform can accommodate
cassettes for three-inch to eight-inch wafers with no mechanical adjustments. A sensor
indicates cassette presence or absence. Note that two adjacent cassette turret
assemblies cannot be accessed at the same time.
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