Strasbaugh nTellect (Model 7AF) Wafer Grinder
14 - 10 Version 1.2 - June 2004
VISUAL WAFER INSPECTION - IDENTIFYING AND CORRECTING SIX
GRIND PROCESS PROBLEMS
The six grind process problems shown in Figure 14-1 and detailed in this section may
be easily identified during a visual wafer inspection.
After identifying a problem, take corrective action by following the instructions shown
below the problem illustration.
Note that the actual grind quality of the wafer must be determined using the
measurement equipment and procedures described in the process specification
provided by the process supervisor.
Figure 14-1 Wafer Surface Finish Examples
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