Strasbaugh nTellect (Model 7AF) Wafer Grinder
9 - 6 Version 1.2 - June 2004
Figure 9-1 Wafer Recipes Menu
Wafer Grinding - Target Wafer Thickness Goal
For wafer grinding on the 7AF, the grinding steps work to a target wafer thickness;
whereas for wheel and chuck dressing and truing, the 7AF removes a specified amount
(in microns) of material from the chuck or grind wheel.
To Next Page
Loading...
