Operations and Maintenance Manual Mechanical Maintenance Procedures
Version 1.2 - June 2004 11 - 5
MECHANICAL MAINTENANCE
OVERVIEW
NOTICE: Be sure to complete the procedures in the sections below before
performing the software calibration adjustments addressed in the
Software Calibration chapter of this manual.
The Mechanical Maintenance Procedures chapter provides step-by-step procedures for
both the grinding and wafer handling area sections of the machine.
The initial alignments section provides detailed procedures for grinding area and
handling area adjustments to be performed when the machine is moved and at other
times as needed.
The remaining mechanical maintenance procedures address the mechanical adjustments
of the bridge, spindles, robot, pre-aligner, spin-rinse station, cassette turrets,
conditioning arms, and digital measurement probes.
Note: Information on the radial, theta (angular), and Z axis robot adjustments are
found in the Software Calibration chapter of this manual.
Assumption
The procedures below were written with the assumption that the reader is thoroughly
familiar with the 7AF Wafer Grinder. If not, read the chapters in this manual on
Physical Description, Installation, Mechanical Description, Control System
Description, Power Distribution, Plumbing Description, and Operator Functions
before beginning any procedure.
Error Messages
See the Troubleshooting chapter of this manual for resolution of any onscreen error
messages not covered in this chapter.
Drawings
Refer to the Engineering Drawings, included in the Appendices of this manual, as
needed when performing the adjustments in this chapter.
To Next Page
Loading...
