After the given number of wafers, a wheel dress message will be issued. In the case of AlTiC and alternative
materials grinding, the send cassettes are disabled and the turrets are locked.
Fine Polish Capability (Force Profile Grinding)
For grinding AlTiC and alternative materials (Machine Variable 82, ATC Grinder), a new mode of operation
has been implemented for the fine grind/polish step. If in AlTiC mode, the Edit Recipe Screen will label the
Fine recipe side as “Force in LBS.” The three steps are now programmed for force, not target thickness!
The Lift step is still programmed in the number of microns to lift after the dwell step.
The sequence for fine grind/polish will now approach the wafer as before, but will feed at the step “rate” until
the programmed force is achieved. Then the next feed rate will be used until the next force goal is reached.
After the step 3 force goal is reached, the force is reduced to the Fine Dwell LBS (variable 55) and the dwell
step is completed.
Throughout the entire grind/polish step, the thickness is being monitored. If the thickness is reduced by more
than the Machine Variable Polish Removal Limit (variable 73), the grind will move immediately to the dwell
step. Because the default value of Polish Removal Limit (variable 73) is 0.0, it must be set prior to fine
grinding in AlTiC mode! Otherwise, a near “air grind” is implemented, meaning that the wafer may be
touched, but little to no material will be removed.
Turrets Seated on Power-up
NEVER manually rotate turrets unless instructed to do so by the software!
The software will now attempt to hold the turrets in place by activating the appropriate controls on power-
up. If it cannot determine the correct control to activate, a fault (alarm) will be activated. This fault will
instruct the operator to “Hand Close Turrets.” Upon sensing the correct position, the controls will be
activated and the turret held in place.
Other Features
There is now a message instructing the operator to remove the dressing pad after dressing a wheel.
Alarms have been added to latch conditions and help in diagnosing “Grind Abort” faults. Specifically, the
“Right and Left Vacuum Abort” and “Service Panel Abort” are now implemented.
Robot Macros
There are two new macro sets for the ESC212 controller. The upgrade to the RP212.MAC macro set adds
more ability to reach wafers below the end effector on the chucks. It can now move more than 0.1” in
searching for the wafer. The SQ212.MAC macro set has been generated to align square wafers. The
Firmware must be version 4.46IMI in order for these macros to work. The ability to align round wafers has
been preserved for manual operation from the EQT software. The round align macro name is “RALIGN”
and is only available manually. The correct macro set must be chosen for the material being ground. Only one
type, round or square, is supported.
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