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Xilinx Zynq-7000 User Manual

Xilinx Zynq-7000
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Zynq-7000 AP SoC and 7 Series FPGAs MIS v4.1 320
UG586 November 30, 2016
www.xilinx.com
Chapter 2: QDR II+ Memory Interface Solution
app_rd_cmd1 Input
Read Command. This signal is used to issue a
read request and indicates that the address on
port 1 is valid.
app_rd_data1[DATA_WIDTH × 2 – 1:0] Output
Read Data. This bus carries the data read back
from the read command issued on
app_rd_cmd1.
app_rd_valid1 Output
Read Valid. This signal indicates that data read
back from memory is now available on
app_rd_data1 and should be sampled.
app_wr_addr0[ADDR_WIDTH – 1:0] Input
Write Address. This bus provides the address
for a write request. It is valid when
app_wr_cmd0 is asserted.
app_wr_bw_n0[BW_WIDTH × BURST_LEN – 1:0] Input
Write Byte Writes. This bus provides the byte
writes to use for a write request. It is valid when
app_wr_cmd0 is asserted. These enables are
active-Low.
app_wr_cmd0 Input
Write Command. This signal is used to issue a
write request and indicates that the
corresponding sideband signals on write port 0
are valid.
app_wr_data0[DATA_WIDTH × BURST_LEN – 1:0] Input
Write Data. This bus provides the data to use
for a write request. It is valid when
app_wr_cmd0 is asserted.
app_wr_addr1[ADDR_WIDTH – 1:0] Input
Write Address. This bus provides the address
for a write request. It is valid when
app_wr_cmd1 is asserted.
app_wr_bw_n1[BW_WIDTH × 2 – 1:0] Input
Write Byte Writes. This bus provides the byte
writes to use for a write request. It is valid when
app_wr_cmd1 is asserted. These enables are
active-Low.
app_wr_cmd1 Input
Write Command. This signal is used to issue a
write request and indicates that the
corresponding sideband signals on write port 1
are valid.
app_wr_data1[DATA_WIDTH × 2 – 1:0] Input
Write Data. This bus provides the data to use
for a write request. It is valid when
app_wr_cmd1 is asserted.
Table 2-7: Client Interface Request Signals (Cont’d)
Signal Direction Description
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Xilinx Zynq-7000 Specifications

General IconGeneral
SeriesZynq-7000
Number of CoresDual-core
Processor SpeedUp to 1 GHz
Device TypeSoC
Logic CellsUp to 350K
DSP SlicesUp to 900
External Memory InterfacesDDR3, DDR2, LPDDR2
I/O StandardsLVCMOS, HSTL, SSTL
Operating Temperature-40°C to +100°C (Industrial), 0°C to +85°C (Commercial)
Package OptionsVarious BGA packages
I/O Voltage3.3V

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