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Xilinx Zynq-7000 User Manual

Xilinx Zynq-7000
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Zynq-7000 AP SoC and 7 Series FPGAs MIS v4.1 66
UG586 November 30, 2016
www.xilinx.com
Chapter 1: DDR3 and DDR2 SDRAM Memory Interface Solution
Implementing the Example Design
For more information on using an IP example design, see the Vivado Design Suite User
Guide: Designing with IP (UG896) [Ref 7].
Simulating the Example Design (for Designs with the Standard User Interface)
The MIG tool provides a synthesizable test bench to generate various traffic data patterns
to the Memory Controller (MC). This test bench consists of a memc_ui_top wrapper, a
traffic_generator that generates traffic patterns through the user interface to a
ui_top core, and an infrastructure core that provides clock resources to the memc_ui_top
core. A block diagram of the example design test bench is shown in Figure 1-39.
Figure 1-40 shows the simulation result of a simple read and write transaction between the
tb_top and memc_intfc modules.
X-Ref Target - Figure 1-39
Figure 1-39: Synthesizable Example Design Block Diagram
UG586_c1_41_120311
ddr2_sim_tb_top or ddr3_sim_tb_top
Example Design
app_addr
app_cmd
app_en
app_hi_pri
app_wdf_data
app_wdf_end
app_wdf_mask
app_wdf_wren
app_rd_data
app_rd_data_end
app_rd_data_valid
app_wdf_rdy
traffic_gen_top
memc_ui_top
ui_top mem_Intfc
DDR2/DDR3
SDRAM
cmd
accept
use_addr
bank_mach_next
data_buf_addr
wr_data_en
wr_data_addr
wr_data_en
wr_data_be
rd_data_en
rd_data
MC
phy_top
error
Parameter:
BEGIN_ADDR
END_ADDR
nCK_PER_CLK
iodelayctrl infrastructure
app_rdy
user_design_top Wrapper
user_design_top
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Xilinx Zynq-7000 Specifications

General IconGeneral
SeriesZynq-7000
Number of CoresDual-core
Processor SpeedUp to 1 GHz
Device TypeSoC
Logic CellsUp to 350K
DSP SlicesUp to 900
External Memory InterfacesDDR3, DDR2, LPDDR2
I/O StandardsLVCMOS, HSTL, SSTL
Operating Temperature-40°C to +100°C (Industrial), 0°C to +85°C (Commercial)
Package OptionsVarious BGA packages
I/O Voltage3.3V

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