Fujitsu PRIMERGY RX300 S8 Upgrade And Maintenance Manual

RX300 S8 Upgrade and Maintenance Manual 293
Processors
11.5.4 Replacing processor heat sinks
11.5.4.1 Removing the processor heat sink
Ê Remove the processor heat sink as described in section "Removing
processor heat sinks" on page 291.
11.5.4.2 Applying thermal paste
Ê Apply thermal paste to the processor surface as described in section
"Applying thermal paste" on page 294.
I If the processor upgrade or replacement kit contains a new CPU heat
sink, a thin layer of thermal compound has already been pre-applied
to its lower surface. In this case, please proceed with section
"Installing the heat sink" on page 289.
11.5.4.3 Installing the processor heat sink
Ê Install the processor heat sink as described in sections "Preparing the heat
sink and processor" on page 288 and "Installing the heat sink" on page 289.
11.5.5 Concluding steps
Ê "Reassembling" on page 63
Ê "Connecting the server to the power source" on page 69
Ê "Switching on the server" on page 71

Fujitsu PRIMERGY RX300 S8 Specifications

General

Memory	Up to 768 GB DDR3
Form Factor	2U rack server
Remote Management	iRMC S4 (Integrated Remote Management Controller)
Chipset	Intel C602
Processor	Intel Xeon E5-2600 v2 product family
Storage	Up to 16 x 2.5" or 8 x 3.5" drives
RAID	RAID 0, 1, 5, 6, 10, 50, 60
Network	4 x Gigabit Ethernet ports
Expansion Slots	6 x PCIe 3.0 slots
Operating System Support	Windows Server, Red Hat, SUSE, VMware
Memory Type	DDR3 RDIMM/LRDIMM
Power Supply	Hot-plug redundant power supply units