Operations and Maintenance Manual Operator Functions
Version 1.2 - June 2004 8 - 37
2. Using a measuring device capable of measurement in microns, measure the
thickness in microns of two untaped wafers. Record the measurement of
each:
Wafer A thickness: _____
Wafer B thickness: _____
3. Place both wafers in a cassette with the major flat of each wafer aligned to
the rear of the cassette.
4. Rotate a send turret away from the robot and place the cassette on it:
Operator Action Explanation/Screen Display
a. Send cassette
icon Touch the desired "Send" cassette icon to rotate
the turret 180 °.
b. Place the cassette on the send turret, centering the cassette on the turret
and seating it firmly within the notches.
5. Rotate a receive turret away from the robot and place the cassette on it:
Operator Action Explanation/Screen Display
a. Receive cassette
icon Touch the desired "Receive" cassette icon to
rotate the turret 180 °.
b. Place the cassette on the receive turret, centering the cassette on the
turret and seating it firmly within the notches.
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