Operations and Maintenance Manual Operator Functions
Version 1.2 - June 2004 8 - 39
8. During referencing, observe the probe thickness readings in the screen
status display area and compare with your wafer thickness measurements:
GOAL: The probe readings on the status display should be
within +/- 2 microns of the measured thickness of the
wafers (from Step 2., above).
Notes: Depending upon the accuracy of the device used in Step 2. to
measure the wafers, the margin of error may need to be
greater than +/- 2 microns.
Referencing takes approximately six minutes.
a. If the goal is met, go on to Step 9., below.
b. If the goal is not met, repeat Steps 3. through 8.
9. After the wafers have been cycled into the receive cassette, read the menu
screen to confirm that the coarse z-axis and fine z-axis were both
successfully referenced:
Operator Action Explanation/Screen Display
a. Confirm referencing
of each chuck. Check for "REFD" messages above the Coarse
and Fine icons, indicating successful referencing.
b. If "REFD" is displayed above both icons, continue on to Step 10.,
below.
c. If "REFD" is not displayed above either icon, repeat the referencing
procedure by following Steps 2. through 9. in this section.
d. If, after repeating the referencing procedure, either icon is still not
displaying "REFD", refer to the Troubleshooting chapter of this
manual.
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