Operation and Maintenance Manual Model 7AF Wafer Grinder
Figure 8-16 Example of a Work Chuck Dressing Recipe 8-63
Figure 8-17 Example of a Work Chuck Truing Recipe 8-63
Figure 9-1 Wafer Recipes Menu 9-6
Figure 9-2 Wheel and Chuck Recipes Menu 9-21
Figure 11-1 Lower Spindle Side to Side Adjustment 11-20
Figure 11-2 Lower Spindle Front to Rear Adjustment 11-22
Figure 11-3 Sketch of Stacking Pattern for Spring Washers
Used with the Fringe Plate Tools 11-27
Figure 11-4 Upper Spindle Probe Reading Points 11-35
Figure 11-5 Upper Spindle Side to Side Adjustment 11-36
Figure 11-6 Upper Spindle Front to Rear Adjustment 11-37
Figure 12-1 Machine Maintenance Menu 12-5
Figure 12-2 Output Control / Input Status Menu 12-18
Figure 12-3 Machine Setup Entry Menu 12-29
Figure 12-4 Top View of Robot Theta Positioning at
Cassette Turret 12-40
Figure 12-5 Top View of Radial Positioning of Robot 12-41
Figure 12-6 Top View of Z-Axis Positioning of Robot 12-42
Figure 14-1 Wafer Surface Finish Examples 14-11
Figure 14-2 Cross-Hatching on the Wafer Edge 14-12
Figure 14-3 Blue-Blacking or Burning 14-12
Figure 14-4 Circular Marks Around Center of Wafer 14-13
Figure 14-5 Cross-Hatching at the Center of the Wafer 14-13
Figure 14-6 Chatter Marks on the Wafer Edge 14-14
Figure 14-7 Star Crack 14-14
Figure 15-1 Grind Data Transfer to Diskette 15-12
Version 1.2 - June 2004 TOC - 17
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