Strasbaugh nTellect (Model 7AF) Wafer Grinder
9 - 8 Version 1.2 - June 2004
Grinding
Step 1
Grinding is divided into the steps shown
below:
During step 1, the wafer is ground from its
original wafer thickness to the step 1 target
thickness goal at the step 1 programmed
feedrate and work chuck speed specified by the
recipe.
Step 2
During step 2, the wafer is ground from the
wafer thickness achieved upon completion of
step 1 to the step 2 target thickness goal at the
step 2 programmed feedrate and work chuck
speed specified by the recipe.
Step 3
During step 3, the wafer is ground from the
wafer thickness achieved upon completion of
step 2 to the step 3 target thickness goal at the
step 3 programmed feedrate and work chuck
speed specified by the recipe.
The step 3 thickness goal is the finished work
thickness.
Dwell
During the dwell segment the grind wheel
height is kept unchanged while the work chuck
rotates the number of revolutions specified by
the recipe at the dwell segment programmed
speed.
Lift
After completion of the dwell segment, the
grind wheel is allowed to lift at a rate (in
microns per second) specified by the recipe to
a height (in microns) specified by the recipe.
Rapid Feed
After the grind wheel has withdrawn from the
wafer by the amount specified for lift, it is
rapidly fed back to its travel height.
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