Operations and Maintenance Manual Mechanical Maintenance Procedures
Version 1.2 - June 2004 11 - 113
8. Move the robot (and the wafer) to the right work chuck.
Touch to Select Explanation/Screen Display
a. Robot icon At the Output Control/Input Status menu, touch
the "Robot" icon to select the Robot drop down
menu.
b. Move To Touch the "Move To" button on the Robot drop
down menu to select it.
c. Right Work Chuck Touch the "Right Work Chuck" button on the
Move To drop down submenu to select it.
The robot should now move to the right work chuck.
9. Visually check the position of the wafer relative to the right work chuck:
GOAL: While still being supported by the robot end effector, the wafer
should be parallel to the right work chuck.
If the wafer is tilted at the right work chuck also, repeat the Level the
Horizontal Rails of the Bed (Front to Rear) procedure, found in the Grinding
Area Initial Adjustments section, above in this chapter.
Note: Repetition of the Level the Horizontal Rails of the Bed procedure
should be a fine tuning only.
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