Strasbaugh nTellect (Model 7AF) Wafer Grinder
14 - 6 Version 1.2 - June 2004
MACHINE OPERATION CHECKOUT
SUBJECT
ACTION
FREQUENCY
Verify Finish:
1. Thickness
2. Edge to Center
< 3 microns
3. Warpage < 1/16 in.
4. No Stress Fractures
5. No Residue on
Wafers
6. Finish
= ___
and
Max Height =
____
Resolution:
(1a) Check/confirm settings.
(1b) Confirm probe adjustment.
(2a) Dress work chuck.
(2b) Check/adjust spindle alignment.
(3) Dress wheel.
(4a) Condition chuck.
(4b) Dress work chuck.
(5) Check spin-rinse scrub brush
height adjustment.
(6) Dress wheel.
Weekly
To Next Page
Loading...
