Strasbaugh nTellect (Model 7AF) Wafer Grinder
14 - 30 Version 1.2 - June 2004
RIGHT CHUCK VACUUM
Cause: Vacuum < minimum
requirement.
Note: Occurs when a request for vacuum
is made and no vacuum is detected after
a timer delay. This can happen at any
time.
Resolution:
• Increase vacuum.
• Check "Rt chuck min vac. " hg."
variable in machine set up variables.
RIGHT CHUCK VACABORT
Cause: Vacuum dropped below the level
set in the machine variables while the
chuck was in motion and a wafer was
present, causing the grind to abort.
Note: Occurs when vacuum is lost
during a grind cycle.
Resolution:
• Check the vacuum delivery system.
• Decrease the right chuck minimum
vacuum machine variable.
(Machine Variable: 91)
ROBOT CHUCK VACUUM
Cause: Vacuum < minimum
requirement.
Resolution:
• Increase vacuum.
• Check end effector surface for
contamination.
• Check for rubber seal degradation.
• Ensure end effector contacts wafer.
• Check vacuum sensor.
SPIN STATION VACUUM
Cause: Vacuum < minimum
requirement.
Resolution:
• Increase vacuum.
• Check "Spin min vac. " hg." variable
in machine set up variables.
• Check chuck surface for
contamination.
• Wafers must be flat and free of
contamination.