Robot Macros 2.03 / May 9, 1995
This revision was installed on the lab machine on May 9, 1995. This revision was to allow sending cassette
pitch and wafer count information to the robot. The Set Wafer Size (SWS) command has been modified to
take cassette pitch and wafer count parameters. These parameters must be used if the command is used
manually. The Scan macro was modified to calculate the proper Z axis travel for scanning.
7AF Version 2.03 Features
10/7/95 Ken Hill
Purpose
Software version 2.03 for the model 7AF is release that incorporates many new features and fixes. This
software must use a new probe control card, the Heidenhain IK121 (SYMIX #223581)! Please review all
of the following descriptions before installing the new version.
This version departs from previous upgrades in that it includes a complete set of updated files that will
replace all existing software to run the 7AF. If for any reason you may want to return to the old version, do
a complete backup of the directory \7AF\EXECODE to a separate directory on the hard drive or backup to
floppy disk. Robot macros must be version 2.03! All FloPro flowcharts and supporting files (.UAI) are
included. All Graphics files (.GRS) are included.
New Heidenhain IK121 Probe Controller
The old Heidenhain controller, the IK120, is now obsolete and must be replaced with the Heidenhain IK121.
All PC cards are being replaced with this version of the software to avoid support problems in the future. The
SYMIX number of the new card is 223581.
Right/Left Grind Offset
Systematic errors, such as grind shape, can lead to small differences in average thickness in product from the
right and left work chucks. Provision for offsetting the grind recipe goal for each work chuck has been added
to compensate for these small differences. This offset can be set at up to +/-10 microns for the right and left
work chucks. These parameters can be set in machine variables 66 and 72, respectively. Positive values will
have the effect of making the wafers thicker and negative values will make the wafers thinner. This feature
should not be used in lieu of setting up the machine properly.
Single Chuck Grind State Retention
Previously, the machine would always default to grinding on both work chucks on initialization. This feature
now retains the last state that was set in the Machine Setup Screen.
Protection Enhancements
The grind cycle (both fine and coarse) will now be stopped if the coolant drops below the values set in the
machine variables. Also, the grind cycle will now abort if a work chuck has stopped for any reason. The
primary cause of the error will display a fault. If this primary cause fault display is cleared for any reason, a
message will still be displayed that the grind cycle was aborted due to an unsafe condition.
Dress/True on a Single Chuck
Previously, when operating with only the right chuck, wheels could not be automatically dressed and trued
because the dressing disk had to be put on the left chuck. The software will now put the dressing disk on the
right chuck if the left one is not available. The chuck grind cycle will now go immediately to "Stopped" if an
attempt is made to grind an unused or disabled chuck. The chuck grind cycle will always start feeding at least
1 micron per second to guarantee that the chuck grind cycle will start properly.
Light Tower
There is now support for a three light tower and buzzer for grinders equipped with one. There is a separate
document to describe this feature.
To Next Page
Loading...
