STRASBAUGH CONFIDENTIAL INFORMATION
5
Do Not Flip Wafers at the Receive Cassette (Series 212 Robot Only)
A change has been made at the receive cassette for wafers that have been ground very thin. In many cases, the
backgrinding tape is thicker than the wafer, causing the wafer to sag when sitting in the receive cassette. When
the robot brings the next wafer, the sagging wafer is in the way. To prevent this problem, it is possible to
request the robot not to flip the wafer when it brings it from the spin station to the receive cassette. With the
robot arm remaining above the wafer, the arm can fill the receive cassette from the bottom up instead of the
usual method of filling from the top down. Now the sagging wafer is no longer in the way.
This feature is sold separately as a software option called “No Flip” having Strasbaugh Part Number 248211.
When the option is purchased, you will receive an additional floppy disk that will unlock the option for use, as
well as instructions telling how to request “No Flip.”.
This new behavior requires that you download new Series 212 macro files sq212_05.mac or rp212_05.mac.