March 24, 2004 7AF Software Version 6.04.0 Features
STRASBAUGH CONFIDENTIAL INFORMATION
1
7AF Version “6.04.0” Features
03/24/2004 Steven Jacobson
Purpose
Software version 6.04.0 modifies the Ind Wafer Grind process that was introduced in software version 5.02 and
completely described in the release notes for that software version.
The wafer being ground in Ind Wafer is the top layer of a three-layer sandwich consisting of wafer plus wax plus
another wafer. The customer supplies a data file containing the thickness of the top wafer for each sandwich in
the send cassette.
Sometimes it is possible to more precisely measure the thickness of the lower two layers instead of the top layer.
For this situation the customer will receive more accurate grinding by supplying that thickness in the data file.
Machine Variable 84, now named Ind Wafer Grind Type, chooses the kind of information in the data file.
With value 0 in variable 84, the data file contains the thickness of the top wafer. With value 1 in variable 84, the
data file contains the thickness of the bottom two layers (wax plus lower wafer).
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