Strasbaugh nTellect (Model 7AF) Wafer Grinder
3 - 16 Version 1.2 - June 2004
GRINDING AREA
The Bridge Assembly (1) moves the upper Coarse (2) and Fine (3) spindles left and
right over the work chucks.
The Coarse (2) and Fine (3) Spindles grind the wafers on the left and right work chucks.
The Left (4) and Right (5) Digital Measurement Probes provide stationary in-process
measuring of wafer thickness.
The Left (6) and Right (7) Conditioning Arms are equipped with cleaning material to
remove debris from the chucks between wafer grinding. To prevent wafer breakage from
grinding debris, conditioning is done just before a new wafer is placed on the chuck.
The Left (8) and Right (9) Work Chucks hold and rotate the wafers; wafers are
retained by vacuum.
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