Operations and Maintenance Manual Physical Description
Version 1.2 - June 2004 3 - 17
WAFER HANDLING AREA
The Pre-Aligner (10) centers the wafer and aligns the notch or flat (usually notch for
eight-inch wafers and flat for six-inch wafers), orienting the wafer for presentation to
the robot.
The Send 1 (11), Send 2 (12), Receive 1 (14), Receive 2 (13) Cassette Access
Turret Assemblies provide wafer cassette access to the operator. The operator opens
the turret access door to place or remove cassettes.
Notes on the Turret Assemblies:
• Two adjacent cassette assemblies cannot be accessed at the same time.
• Wafers are loaded in cassettes device-side up.
The Spin-Rinse Station (15) moves a brush from the center to the edge of the wafer,
rinses the wafer with D. I. water, and spins the wafer up to 4000 RPM until dry.
The Robot (16) is equipped with a rotating wrist and a single vacuum chuck end
effector to permit picking the wafer up from either the bottom or top as needed. The
following is a summary of the sequence of robot movements in relation to other
machine movements:
1. wafer is picked up at send cassette device-side up
2. wafer is flipped
3. wafer is set on the pre-aligner
4. wafer is picked up device-side down
5. wafer is placed on work chuck device-side down
6. wafer is ground
7. wafer is picked up, still device-side down
8. wafer is taken to spin-rinse for cleaning of the ground surface
9. wafer is picked up device-side down
10. robot wrist rotates to present wafer to receive cassette device-side up
The robot travels in a circular motion with approximately 350 degrees of motion (a
dead zone exists at the front center of the machine). The robot has Z, radial, and theta
motion.
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